71M | 3X | F9-F159.9 | 2.0-35.7μm – Line Scan Telecentric Lens
Features
Suitable for semiconductor packaging, BGA solder ball 3D scanning, precision electronics, high-speed detection, defect screening and other industry applications.
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In order to ensure the uniformity and lighting effect of coaxial light, the light output performance requirements of the point light source are as follows:
| Model No. | JC-CTHC3XD-41-M58 |
| Magnification | 3X |
| Object FOV | Φ13.7mm |
| Working Distance | 65mm±3% |
| Telecentricity | <0.1° |
| Depth of Field | 0.11~2.0mm |
| F No. | F9~F159.9 |
| Resolution | 2.0~35.7μm |
| Image MTF | >0.3@115~6.5lp/mm |
| Optical Distortion | <0.061% |
| Measurement Range | Sensor Specification | Sensor Size | FOV |
| 71M | 31mmx22mm | 10.3mmx7.3mm | |
| 2” | 23mmx23mm | 7.7mmx7.7mm | |
| 7/4” | 22.5mmx16.9mm | 7.5mmx5.6mm | |
| 2K Line Scan | 2048×10μm | 6.8mm | |
| 4K Line Scan | 4096×7μm | 9.6mm | |
| 8K Line Scan | 8192×5μm | 13.7mm |