71M | 2X | F10-179.5 | 3.3-59.2μm – Line Scan Object Telecentric Lens
Features
Suitable for semiconductor packaging, BGA solder ball 3D scanning, precision electronics, high-speed detection, defect screening and other industry applications.
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| Model No. | JC-CTHDT2X-110-M58 | ||
| Optical Structure | Object Telecentric | ||
| Magnification | 2X | ||
| Object FOV | Φ20.5mm | ||
| Image FOV | Φ41.0mm | ||
| Working Distance | 110mm±3% | ||
| Telecentricity | <0.16° | ||
| Depth of Field | 0.28-5.1mm | ||
| F No. | F10-179.5 | ||
| Resolution | 3.3-59.2μm | ||
| Image MTF | >0.3@100-5.8lp/mm | ||
| Optical Distortion | <0.050% | ||
| Measurement Range | Sensor Specification | Sensor Size | FOV |
| 71M | 31mmx22mm | 15.5mmx11.0mm | |
| 2” | 23mmx23mm | 11.5mmx11.5mm | |
| 7/4” | 22.5mmx16.9mm | 11.3mmx8.5mm | |
| 4/3” | 18mmx13.5mm | 9.0mmx6.8mm | |
| 2K Line Scan | 2048×10μm | 10.2mm | |
| 4K Line Scan | 4096×7μm | 14.3mm | |
| 8K Line Scan | 8192×5μm | 20.5mm | |