71M | 2X | F10-179.5 | 3.3-59.2μm – Line Scan Object Telecentric Lens

Features

• The object telecentric structure ensures that the main light of the object side is parallel to the optical axis, eliminating perspective error.
• Large target surface support, high resolution.
• Anti-vibration design, high temperature resistance, multi-interface compatibility

Suitable for semiconductor packaging, BGA solder ball 3D scanning, precision electronics, high-speed detection, defect screening and other industry applications.

Resources

Download Datasheet(PDF)