71M | 3X | F9-F159.9 | 2.0-35.7μm – Line Scan Telecentric Lens
Features
Suitable for semiconductor packaging, BGA solder ball 3D scanning, precision electronics, high-speed detection, defect screening and other industry applications.
Resources
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In order to ensure the uniformity and lighting effect of coaxial light, the light output performance requirements of the point light source are as follows: